Welcome
to the home page of the Cadence Users Group at the Electrical Engineering and
Computer Science Department of Northwestern University.
This page contains information about the Cadence design tools used in classes in the
Department of Electrical Engineering and Computer Science. Students obtain
practical experience in electronics design using state-of-the-art CAD tools,
computing and laboratory facilities.
Program Goals:
Value Added
Items:
Two Silicon Ensemble tutorials
Student
Projects:
Analysis of
inversed temperature dependence during dual Vth
assignment
Analysis for
timing variation due to process variations
Please check this section for
newly added student design projects using Cadence design tools.
Classes:
Cadence design
tools will be used in the following courses:
|
Course |
Course Title |
Description |
|
EECS 391 |
VLSI Systems Design |
Students will
become familiar with the realities of CMOS VLSI design: Proper layout structures,
and the impact of fabrication technologies; Methods for optimizing the area,
speed, and power of circuit layouts; The use of CAD tools for both schematic
and layout of complex CMOS circuits; Methods for testing of circuit designs,
both during creation and on individual die; Tradeoffs in device
implementation technologies, such as Full-custom, standard cell, gate array,
FPGA, PLD. Students will create various custom IC implementations using the
Custom IC layout tools from Cadence. |
|
EECS 303 |
Advanced Digital Design |
Upcoming revision, new course content planned: Students will
be introduced to Hardware Description Languages and their mapping to gate
level logic structures using Encounter. |
|
EECS 355 |
ASIC & FPGA Design |
Students gain
experience writing hardware descriptions in VHDL using several different
styles (including behavioral, gate level design and Register Transfer Level Design).
They use industry standard computer-aided design tools including Cadence
Digital IC design products. Each student will have the opportunity to design
several projects individually and work in groups to create larger designs. |
Research
Projects:
Cadence Design Tools are currently
being used for the following research groups:
NEW: Parallel
Architecture Group at Northwestern: Power dissipation and energy
consumption have become one of the most important problems in processor and
more generally data center design. While lowering the operational voltage
beyond guard-band can dramatically reduce power consumption, it will also introduce
timing-errors to the system. However, not all computations and all data need to
maintain 100% accuracy. We propose to occasionally relax the reliability
guarantees of the hardware layer based on the software requirements. By
steering each computation and data to different functional and storage units
with different voltage levels, Elastic Fidelity Computing obtains power and
energy savings while reaching the reliability targets required by each
computational segment. We will use Cadence Digital IC design products to build
our hardware model which corelates voltage level and error rate.
NEW: Bio-Inspired
Sensors and Optoelectronics Laboratory uses Cadence custom IC design tools to
design and develop very high-performance read-out integrated circuits (ROIC)
for the next generation focal plane arrays with multiple-megapixel resolution.
The ROICs are tailored for novel high-sensitivity imager elements with internal
amplification such as the nano-injection detectors, and they offer high
versatility, high timing accuracy with low noise levels.
Laboratory of Application and
Domain-Specific Computing investigates development of various domain specific
programmable processors as well as customized hardware programmable fabrics for
high performance and /or low power computing. Implementation and performance
analysis of various functional units, memory structures, and interconnect
networks is carried out using the Cadence design environment.
Laboratory of Design and Analysis
of High-Performance ICs utilizes custom IC design tools for design and modeling
of novel high performance circuits. Currently, investigations on thermal
modeling of high performance ICs is carried out.
Laboratory of Application
Specific Instruction Processors and Microarchitecture investigates the impact
of parametric process variations on the timing of processor components and
furthermore the resulting variations in chip yields.
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"CadenceÔ is a registered trademark of Cadence Design Systems, Inc.,
Seda Ogrenci
Memik, sedaateecs.northwestern.edu
Last
modified: February 10, 2012