Ja Chun Ku

Ph.D. Student (Advisor: Prof. Yehea Ismail)
Department of Electrical Engineering and Computer Science
Northwestern University, Evanston, IL

Office: M316
Phone: (847) 467-7852
E-mail: j-ku@northwestern.edu

Biography

Research

Publications

Resume (pdf)

Last updated on 09/29/2005

Biography

Ja Chun Ku was born in Puchon, Korea on April 25^th 1981. Due to his father's work, his family moved to Singapore in 1993 where he attended United World College of S.E.Asia, and received the International Baccalaureate in 1999. He attended Northwestern University, Evanston, IL from 1999, and received the B.S. degree in computer engineering in 2003. In September 2003, he joined the Design & Analysis of High Performance IC Lab at Electrical and Computer Engineering department, Northwestern University as a Research Assistant, and is currently pursuing the Ph.D. degree in computer engineering with an emphasis in design and analysis of VLSI circuits under thermal effects.

Research

Ja Chun Ku's research area includes:

• changes in design methodologies and optimization techniques for VLSI circuits under thermal effects
• low-power design and leakage control issues
• analysis of thermal-induced problems and circuit/physical level solutions
• thermal network and circuit modeling issues

Publications

• Ja Chun Ku and Yehea Ismail, Area Optimization for Leakage Reduction and Thermal Stability in Nanometer Scale Technologies, To appear in Proc. Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2006 (Invited paper)

• Ja Chun Ku, Serkan Ozdemir, Gokhan Memik, Yehea Ismail, Thermal Management of On-Chip Caches Through Power Density Minimization, To appear in Proc. IEEE/ACM International Symposium on Microarchitecture (MICRO-38), Nov. 2005

• Ja Chun Ku, Maged Ghoneima, Yehea Ismail, The Importance of Including Thermal Effects in Estimating the Effectiveness of Power Reduction Techniques, in Proc. IEEE Custom Integrated Circuits Conference (CICC), pp. 301-304, Sep. 2005

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